The BSC tools remove the Bonded Semi-Conductor leaving a preset length of exposed Bonded Semi-Conductor. The adjustable blade allows controlled cut depths of 0.4mm to 1.4mm and also chamfers the Semi-Conductor quickly and efficiently as it cuts in a helicoidal manner to leave a perfect surface for efficient cable jointing.

The BSC 144425 tool has been specifically designed for the UK market and incorporates a larger diameter range, deeper cut depth from 0.4mm to 1.5mm and a remaining Bonded Semi-Conductor length of either a preset 25mm or variable up to 40mm.